Packaging Engineer
Packaging Engineer
This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.
Who We Are:
Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work.
We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here.
We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.
If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.
Job Description:
Responsibilities:
* Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.
* Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
* Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development.
* Participates as a member of project team of other mechanical hardware engineers and internal and outsourced
Education and Experience Required:
* Working towards a degree in Packaging Engineering.
* or Typically 0-2 years' experience
Knowledge and Skills:
* • Experience or understanding of SolidWorks, Pro Engineer or other 3D CAD software as a mechanical design tool.
* • Good analytical and problem-solving skills.
* • Understanding of design for sheet metal and plastic parts and associated production tooling and processes.
* • Understanding of thermal properties of materials and heat transfer.
* • Good written and verbal communication skills; mastery in English and local language.
Additional Skills:
Accountability, Accountability, Action Planning, Active Learning, Active Listening, Agile Methodology, Agile Scrum Development, Analytical Thinking, Bias, Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data Analysis Management, Data Collection Management (Inactive), Data Controls, Design, Design Thinking, Empathy, Follow-Through, Group Problem Solving, Growth Mindset, Intellectual Curiosity (Inactive), Long Term Planning, Managing Ambiguity {+ 5 more}
What We Can Offer You:
Health & Wellbeing
We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.
Personal &...
- Rate: Not Specified
- Location: Chippewa Falls, US-WI
- Type: Permanent
- Industry: Engineering
- Recruiter: Hewlett Packard Enterprise Company
- Contact: Not Specified
- Email: to view click here
- Reference: 1195957
- Posted: 2025-11-19 08:03:52 -
- View all Jobs from Hewlett Packard Enterprise Company
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